60GHz High Speed Wireless Link-Technology and Design Challenges

摘要：

The recent success of millimeter wave integrated circuit designs in silicon has triggered a wave of interest and activity in a wide range of high speed wireless applications at 60GHz. In this paper,we will review the latest developments in design and technology for 60GHz multi-gigabit-per-second wireless communications. We will address the requirements and challenges for device performance,modeling and circuit design at millimeter wave frequencies,with a discussion of the advantages and disadvantages of SiGe BiCMOS and RFCMOS technology. Packaging,antenna design and integration will also be discussed.

作者: Dawn Wang Ned Cahoon

作者单位: IBM Corp,Westford,MA01886,USA

会议类型: 国际会议

会议名称: 9th International Conference on Solid-State and Integrated-Circuit Technology(第9届固态和集成电路国际会议)

会议地点: 北京

会议语种:英文

页码: 1343-1347

在线出版日期: 2008-10-20（万方平台首次上网日期，不代表论文的发表时间）