Multiband RF-Interconnect for CMP Inter-Core Communications

摘要：

In this paper,we propose a novel on-chip global interconnect that would meet stringent challenges of core-to-core communications in data rate (up to 1OOGbps /link),latency and re-configurability for future chipmicroprocessors(CMP) with efficient area and energy overheads. We discuss the limitations of traditional RC-limited interconnects and possible benefits of multi-band RF-interconnect (RF-I) through on-chip differential transmission lines. The physical implementation of RF-I and its projected performance versus overhead as the function of CMOS technology scaling are addressed as well.

作者: M.-C.Frank Chang

作者单位: Electrical Engineering Department,University of California,Los Angeles,Los Angeles,California,USA

会议类型: 国际会议

会议名称: 9th International Conference on Solid-State and Integrated-Circuit Technology(第9届固态和集成电路国际会议)

会议地点: 北京

会议语种:英文

页码: 1811-1814

在线出版日期: 2008-10-20（万方平台首次上网日期，不代表论文的发表时间）