Analysis of RLC Interconnect Delay Considering Thermal Effect

摘要：

Based on the equivalent Elmore delay model,a new delay model that takes inductance and thermal effect into consideration is presented in this paper. The proposed model with high efficiency has closed-form expressioa Its solution exhibits high accuracy as compared to the other models. Simulation results show that the error in the propagation delay is less than 10% for RLC tree example.

作者: Gang Dong Peng Leng Yintang Yang Changchun Chai

作者单位: Institute of Microelectronics,Xidian University,Xian 710071,P.R.China

会议类型: 国际会议

会议名称: 9th International Conference on Solid-State and Integrated-Circuit Technology(第9届固态和集成电路国际会议)

会议地点: 北京

会议语种:英文

页码: 2256-2259

在线出版日期: 2008-10-20（万方平台首次上网日期，不代表论文的发表时间）