Design Space Ezploration for 3D Integrated Circuits
Three-dimensional integrated circuit (3D IC) is emerging as an attractive option for overcoming the barriers in interconnect scaling,thereby offering an opportunity to continue performance improvements using CMOS technology. 3D IC offers the advantages of high performance,low power,smaller form-factor,and heterogeneous integration benefits. However,to enable the wide adoption of the 3D integration technology,there exist many challenges that need to be addressed. First,cost analysis at the early design stage to help the decision making on whether 3D integration should be used for the application is very critical. EDA design tools are the key to enable effective 3D IC designs; design space exploration at the architecture design is also important to fully take advantages that 3D offers. This article provides a tutorial on the design tools and methodologies to help design space exploration in 3D IC designs.
Yuan Xie Yuchun Ma
The Pennsylvania State University,University Park,PA,USA Tsinghua University,Beijing,China
国际会议
9th International Conference on Solid-State and Integrated-Circuit Technology(第9届固态和集成电路国际会议)
北京
英文
2317-2320
2008-10-20（万方平台首次上网日期，不代表论文的发表时间）