UV-LIGA metal MEMS: A promising tool to serve IC industry

摘要：

Metal MEMS structures can be formed by metal electroplating with the aid of thick-photoresist molds. The microfabrication features low-temperature process that is post-CMOS compatible and can be used for on-chip integration of high-performance RF parrives for RFlCs. On the other hand,The plating process can be combined with silicon micromachining techniques to build operation tools,like probe-cards,for wafer-level IC testing. The presentation addresses the promising techniques and achievements in device prototypes.

作者: Lei Gu Zhengzheng Wu Fei Wang Rong Cheng Kewei Jiang Xinxin Li

作者单位: State key Lab of Transducer technology,Shanghai Institute of Microsystem and Information Technology,Chinese Academy of Sciences,Shanghai 200050,China

会议类型: 国际会议

会议名称: 9th International Conference on Solid-State and Integrated-Circuit Technology(第9届固态和集成电路国际会议)

会议地点: 北京

会议语种:英文

页码: 2357-2360

在线出版日期: 2008-10-20（万方平台首次上网日期，不代表论文的发表时间）