Development of a CMOS-compatible Electrostatically Actuated Diaphragm Chamber for Micropump Application

摘要：

This paper presents the development of a diaphragm chamber actuated electrostatically utilizing CMOS-compatible silicon micromachining fabrication process. The process consists of six photolithography steps and five chemical vapor depositions. Etching of the sacrificial oxide layer for the diaphragm chamber is achieved using etch-release holes perforated on the diaphragm,similar to via holes used in IC-fabrication method. From the analysis,the best encapsulation has been successfully demonstrated by growing LPCVD silicon nitride of thickness 0.9um. Accomplishing this feat enables electrostatically actuated diaphragm chamber to be developed and in particular,will spur advancement in the development of a CMOS-compatible electrostatically actuated diaphragm micropump.

作者: Hing Wah Lee Muhamad Ramdzan Buyong Mohd.Ismahadi Syono Ishak Hj.Abd.Azid

作者单位: Microsystems and MEMS,MIMOS BERHAD,Technology Park Malaysia,57000 Kuala Lumpur,Malaysia Department of Mechanical Engineering,Universiti Sains Malaysia,Seberang Perai Selatan,14300 Penang,M

会议类型: 国际会议

会议名称: 9th International Conference on Solid-State and Integrated-Circuit Technology(第9届固态和集成电路国际会议)

会议地点: 北京

会议语种:英文

页码: 2500-2503

在线出版日期: 2008-10-20（万方平台首次上网日期，不代表论文的发表时间）