High-End Flex-Rigid Boards: Case-Studies and Reliability
The need for flex-rigid printed circuit boards has been rising dramatically in recent years-due to demand for medical devices, as well as military, aerospace and other compact equipment. The main advantages of flex-rigid boards are reduction of weight, increased reliability of the interconnect and the possibility to bend and fold the circuit to fit a determined space or shape. Flex-rigid boards enable miniaturization and 3-dimensional boards; they eliminate cables and improve electrical characteristics, thus enormously increasing the reliability of the board related to wiring and assembly steps. Naturally, the lower weight and improved surface-to-volume ratio add to the interest in these boards.In this presentation we will cover the different materials used for manufacturing high-end flex-rigid boards, as well as some novel and sophisticated build-ups. We describe the different types of holes and techniques for via-filling and improve assembly reliability, and then proceed to point out the advantages and disadvantages of each method. Furthermore, we will discuss some of the problems encountered while manufacturing complex circuits and symmetrical or non-symmetrical boards. We will present faults and problems encountered in case studies of different designs and failure analysis.
R.Tulman E.Zilberleib S.Danino N.Farchi
Eltek Ltd.Petach Tikva,Israel
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）