Effects of lead-free on HDI PCB and the improvement method
This research paper details the reasons of HDI PCB de-lamination. The main reasons of HDI PCB delamination include: (1) the resin of normal laminate degrade in the higher temperature up to 240~260 ℃ in lead free, new laminates may be needed to accommodate the higher soldering temperatures associated with lead free assembly. (2) Moisture which is created during soldering from the entrapped water can result in de-lamination. (3) Glass fiber is not well associated with the resin. (4) Additional z-axis expansion during excursions to higher soldering temperatures, and so the difference of the z-axis coefficient of thermal expansion (CTE) between the copper and the resin is increasing. The paper also recommends the rules of design for manufacturing (DFM).
PCB Lead Free HDI delamination
Fu Haitao Cheng Fanxiong Yang Qianrong Fang Junliang Huang Wei
Shanghai Meadville Science & Technology Co.,Ltd. Shanghai Meadville Electronics Co.,Ltd Shanghai China
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）