PCB Image Transfer Process Failure Management Practice

摘要：

PCB’s open circuit, notch, short circuit are characteristic failure in image transfer process and with track density increasing, these failures are more obvious. Normal solution is observing failures, analyze root cause and then raise solutions. This thesis aims at raising TPC problem solving thinking method, ie positive setting. That is to set specification for products finished in every process, and specification for input factors. After confirming the elements that do not comply with specification, carry out technology improvement and implement technology management. Thus continuously reduce track failure scraping rate.

关键词： technology improvement technology management and specification

作者: Ye Jun

作者单位: Tianjin Printronics Circuit Corp.Tianjin China

会议类型: 国际会议

会议名称: 第十一届世界电子电路大会

会议地点: 上海

会议语种:英文

在线出版日期: 2008-03-17（万方平台首次上网日期，不代表论文的发表时间）