Thermal Performance Study of Lead-Free Compatible FR-4 Laminates
As the environmental consciousness in the world runs high, European union implemented the RoHS formally from July 1st of 1996, Lead(Pb),Cadmium(Cd),mercury(Hg), hexavalent-chromium (Cr+6) compounds, polybrominated biphenyl (PBB), and polybrominated diphenyl ether (PBDE) was strictly prohibited in the use of electric and electronic product. To suit the demand of lead-free, IPC drew the new standard of lead-free FR-4 laminate in “Specification for Base Materials for Rigid and Multilayer Printed Boards accordingly. And the requirement about the thermal resistance just as Tg,Td,Time to delamination and CTE etc. were put forward in addition.In this article, We have apply differential scanning calorimetry (DSC), thermo gravimetric analysis (TGA) and thermomechanical analysis (TMA) to study the influence factors about the thermal resistance of lead-free FR-4 laminate, The results reveal that using novolac resin as curing agent to replace the traditional dicyandiamide in formula, the laminate can gain an excellent thermal stability. Furthermore, Bromine in resin will affect the thermal resistance of laminate. Td of laminate due to decomposition of resin in presence of bromine showed a decreasing trend with increasing bromine concentration. On the other hand, Introducing novolac epoxy into the FR-4 epoxy system can enhance the cross-linking density and the temperature of glass transition of laminate effectively.
Fang kehong
Guangdong Shengyi Sci.Tech Co.,Ltd.Dongguan Guandong China
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）