PCB Laminates Performance in High Temperature Lead-Free Assembly

摘要：

Lead-free assembly of electronic products requires FR-4 laminates with better outstanding thermal performance. In this paper behavior of laminates applied in high layer count rigid PCB is summarized. The results are useful to multi-layer PCB design and manufacture. By classifying FR-4 laminate and testing the CAM design of high layer count rigid PCB is analyzed with the focus of laminate performance.

关键词： lead-free assembly

作者: Kong lingwen Xiong jia Daniel Song

作者单位: Shenzhen Shennan Circuits Co.,Ltd Guangdong China

会议类型: 国际会议

会议名称: 第十一届世界电子电路大会

会议地点: 上海

会议语种:英文

在线出版日期: 2008-03-17（万方平台首次上网日期，不代表论文的发表时间）