The Impact of Laminate Copper Thickness on Peel Strength
Surface etching is one of the common treatment methods in PCB shop. Through surface etching, we can get different thickness of copper layer to meet PCB manufacturing requirement. Now as the SAP (semi-additive process) is developing, the method is more frequently used. One of the processes of SAP is to thin base copper to get more fine lines. The thinner base copper thickness is, the less side-etch distance will have. At the same time that does mean the less line width variance. But as the base copper is thinned, how does the peel strength of copper and base material change? By testing, we have found that when the base copper thickness ranges from 4um to 8um, the peel strength is same; the results also meet the IPC requirement, even after thermal shock. While the thickness base copper thins to copper nodule (the layer inlayed in the surface of base material) some of the test result can’t reach IPC requirement of 1.05N/mm. This will bring risk of reliability. When the base copper is etched completely and the surface of base material isn’t treated by permanganate solution or others, the peel result is less than 0.6N/mm, can’t reach the IPC requirement.
Qiu Yanjia Chen Huali
China Circuit Technology (Shantou) Corporation Shantou,Guangdong,China
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）