Failure Analytical Methods and Solutions on BGA Solder Joint of ENIG PCB
The quality of electronic products relies closely on the reliability of solder joint, particularly for solder joints of BGA. So how to prevent the BGA solder joints failure is an important issue concerned by PCB and PCBA manufacturers. In this paper, several failure analytical methods are discussed, combined with some failure cases of ENIG BGA. At the same time, some preventive measures on produce process，PCB design and assembly are introduced too.
BGA Solder joint Failure analysis Black Pad
Li Fu Chen Peihui
China Circuit Technology (Shantou) Corporation Shantou,Guangdong
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）