The Study of Semi-Additive Process

摘要：

Semi-additive process is one of the methods for fine line manufacturing. Its process flow is different from conventional subtractive method. Through the following two different processes: ultra-thin copper foil and surface uniform etching process, the article had found that the base copper thickness, the roughness of laminate surface, the etching solution is the important key factors.

作者: Chen Huali

作者单位: China Circuit Technology (Shantou) Corporation Shantou,Guangdong,China

会议类型: 国际会议

会议名称: 第十一届世界电子电路大会

会议地点: 上海

会议语种:英文

在线出版日期: 2008-03-17（万方平台首次上网日期，不代表论文的发表时间）