Patterned Metallization on Flex and Rigid Substrates Based on Desktop Printing
Two non-photolithographic approaches for patterned metallization on flex and rigid substrates employing desktop printing are presented. The first comprises an initial self-assembly of aminosilane as the organic glue layer on the substrates followed by inkjet printing of Au colloids or Pd(II) species as the catalyst template and finalized by selective chemical plating to form desired patterns of metals. The second starts with a inkjet/laser printing of a resist pattern on the copper clad boards, followed by the conventional selective etching.The ability of fabricating patterned metal structures on the surface of semiconductors and insulators is essential to the microelectronic industry.1 Currently, photolithography is the predominant strategy for patterned molding with masks in the microfabrication. However, this strategy requires high-cost facilities and operations, and may not be suitable for prototype and small patch of board production. Moreover, it is not compatible with newly developed microelectronic materials, for example the organic semiconductors, for the laser used in photolithography may lead to decomposition of the materials. To address these issues, a non-photolithographic strategy is required as a complement.
Wang Jinyi Liu Fangqing Cai Wenbin
Department of Chemistry,Fudan University Department of Environmental Engineering, Shanghai University of Electric Power,Shanghai,China
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）