Development of Flex-based Embedded Actives Packages
In recent years, the mobile phone has evolved from being just a phone to a multi-functional device, combining the functions of various devices into a single phone, such as music and video player, camera, PDA, email and video messaging etc. Despite all these functions, users demand that the phone must be small and light weight, with an aesthetically designed form-factor. This requires that the phone designers continued squeeze as much circuit features and components into a small area, and yet keeping overall costs low.This has spurred all suppliers from semiconductors to substrate manufacturers into continual development of miniaturization technology to achieve these goals, particularly in the continual adoption of high-density designs on the printed circuit boards (PCB), and the emerging embedded packages or system-in-packges(SiP). The SiPs enable several IC packages to be combined into a single SiP, or enable the naked dies to be embedded directly within a multilayer PCB substrate. These packages would enable the phone designers to keep all necessary functions and potentially reduce overall device cost.The rise in SiPs had also blurred the line between IC packaging manufacturers and substrate manufacturers and assemblers. Most development of embedded packages use traditional PCB materials, however the use of flex substrate or copper foil base enable the manufacturer to make the entire package thinner. This paper presents the development of the embedded technology on copper foil and flexes substrates, and also lists the challenges involved for commercialization. The successful initial results showed that this process has potential.
Ronnie Chin Tien Siang Chia Kebao Wan Thai Houng Tiong Wil Peels
MFS Technology,Singapore NXP Semiconductor,IS&O
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）