The Study of White Residue Formation on the PCB after Wave Soldering Assembly
The purpose of this study is to investigate what cause the formation of white residue on the printed circuited board. White residue was successfully duplicated on the PCB by the internal simulation test under a high humidity and high temperature (85deg, 85％HR) environment. SEM& EDX analysis on the white residue powder reveals that the chemical composition of white residue are Sn, C and O only, even if the white residue is formed in different morphology. This study found that direct contact with high humidity environment may be one of the primary causes of the white residue formation on the printed circuited board. Flux chemistry and board finish are also factors to contribute to the formation of the white residue.
Zhang Ruifen
Kester Component Pte Ltd,ITW Singapore
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）