New Generation Low Dielectric Constant and Loss Material for High Frequency Application
As wireless communication and broadband application technologies rapidly evolve, the demand for low dielectric constant (Dk) and low loss tangent (Df) base materials has increased continuously. Especially when the frequency increases, the signal integrity in the high frequency range such as 5 to10GHz becomes very important. In order to achieve the above application, many low Dk & Df base materials have been developed. However, there are some problems for these materials, such as high cost and poor processability. Based on this background, an optimized performance/cost solution for high frequency application is presented in this paper. By using special epoxy and hardener, a new generation low Dk & Df laminate material has been developed. IT200Dk and IT150D show excellent thermal resistance, low thermal expansion, and low moisture absorption. Their properties, such as Td, T-288, and CTE, meet the requirement for lead-free assembly. The PCB samples passed reliability test, such as IST (>800 cycles), Reflow (260℃x6), and thermal shock (288℃/10sec/6times). In addition, IT150D showed ultra low Dk & Df properties comparing to traditional high frequency materials.
Sanny He Jeng-I Chen Elren Zhang
ITEQ(Dongguan) Corporation Humen Town,Dongguan City Guangdong Province,China
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）