The Characterization of Plasma Desmearing in Etching Back Hole

摘要：

This paper introduces a method of characterizing the plasma desmearing and etching back of the hole. The experiment of the plasma desmearing on the general thickness-diameter ratio PCB (4:1) and high thickness-diameter ratio (17:1) proved that the plasma desmearing has extremely good uniformity, controllability, and repeatability and therefore we can control the quantity of etching back of the hole by using the characteristic method.

作者: Bei Chen Zhidong Li

作者单位: Guangzhou Fast-print Circuit Co.LTD Guangzhou city,Guangdong province,P R China

会议类型: 国际会议

会议名称: 第十一届世界电子电路大会

会议地点: 上海

会议语种:英文

在线出版日期: 2008-03-17（万方平台首次上网日期，不代表论文的发表时间）