Influence of manufacture processes to the flexibility of FPC
More and more FPCs are applied in modern electrical products because of light weight, small volume and flexibility. At meantime, with the development of electrical products, more strict demands are required to FPCs, for example, FPCs of foldable cellulars and slidable cellulars, must be met over 100,000 times folding/sliding. There are many factors to influence the flexibility of FPCs, such as, the character of FPC materials, the pairs of FCCL and coverlayer, manufacture processes, FPC structure, and products structure etc.In the study, the influence of manufacture processes to the flexibility of FPC was discussed, the processes including plating, flash plating, microetching, laminating and brushing board etc. We can draw the following conclusions from exploring the influence of manufacture processes to the flexibility of FPC. 1) For the dynamic flexing FPC, plating thickness in dynamic area should be controlled strictly; 2) Disadvantage influence to the flexibility of FPC won’t be produced in the microetching process, thus, the moderate microetching process could be done only assuring the copper thickness not lowering the demanded thickness; 3) Brushing board could be done. In order to assure not destroying the copper crystal, the direction and pressure of brushing board must be chosen; 4) Laminating can influence the flexibility of FPC, thus, the laminating times should be controlled.
Flexible Printed Circuits Flexibility Manufacture process
Chen Bing Zhang Xuefan
AKM Electronics Industrial (PANYU) LTD.Guangdong China
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）