Developing a Halogen-free, Phosphorous-free, and High Thermal Reliability Copper Clad Laminate (CCL)
At present, brominated epoxy resin and phosphorous-containing epoxy resin are commonly used in the production of flame retardant copper clad laminate (CCL). However, many people are concerned that the burning process of brominated epoxy resin and phosphorous-containing epoxy resin may emit hazardous substances, prompting them to propose a halogen-free and phosphorous-free requirement.In July 1, 2006, two directives of the European Union (E.U) were formally implemented. The move by EU also signaled the entry of the global electronics industry into a lead-free soldering era. The increase in soldering temperature also caused a corresponding increase in the thermal reliability of CCL.This project used a nitrogen-containing resin system to replace the conventional brominated epoxy resin and phosphorous-containing epoxy resin. The effect of nitrogen equips the product with a flame-retardant property and successfully develops an environment-friendly CCL that is halogen-free, phosphorous free, and possesses a high thermal reliability.
Gu Xinshi
Guangdong Shengyi Sci.Tech Co.Ltd.Guangdong China
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）