Impact of Lead-Free Soldering on Heavy Copper Printed Circuit Boards by Interconnect Stress Testing (IST)
The RoHS Directive plays a key role that push electronics manufacturers to the era of lead-free assembly. Manufacturers of lead-free assemblies face reliability challenges because the peak reflow temperature must be increased by nearly 30°C. Competent laminating materials used for the printed circuit boards manufacturing must be able to survive under these elevated reflow temperatures. The potential for thermomechanical fatigue of plated through holes, interconnect defects and barrel cracks, and delamination during the lead-free soldering process should be carefully verified.Heavy copper printed circuit boards are applied in many fields such as power supplies, motor controllers, and uninterruptible power supplies. The introduction of lead-free soldering makes long term reliability a challenge for these applications.This paper presents an IST approach on the reliability of heavy copper printed circuits boards under leadfree soldering. Further investigation on the failure modes and materials analysis helps us clarify the dominant parameters.
Mason Yeh Demi Jiang Richard Cheng
Atotech Taiwan Limited
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）