No Flow Prepreg with Enhanced Thermal Resistance for Rigid-Flex PCBs
As rigid-flex PCBs offer the flexibility in circuit design, they can be made smaller and thinner in size as well as lighter in weight than conventional PCBs. No flow prepreg plays an important role in the production of rigid-flex boards to provide reliable bonding between rigid and flexible materials. Two newly developed no flow prepreg are studied for their properties and reliability. One is a halogen-free material and the other is a bromine-containing non-dicy material. These two materials show Td higher than 325℃ and T-288 longer than 10min indicating that these resin systems are thermally very stable. Results from the reliability test on rigid-flex samples show that these samples pass thermal shock test (solder dip 288℃/10sec/6times). Both materials exhibit superior thermal stability and reliability to conventional bromine-containing dicy-cured no flow prepreg material. Based on the investigation, it is concluded that these two new materials are suitable for lead-free soldering assembly.
Bin Jian Jeng-I Chen
ITEQ Corporation
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）