Characterization of Immersion Tin Coating Properties for PWB
In order to meet the requirement of RoHS, including the elimination of lead from electronic components, the printed circuit board industry is moving away from lead bearing hot-air-solder-leveled final finishes to alternative materials. Immersion tin has been available on the market for some time, in spite of its high manufacturing cost and difficulties in processing, because it provides a thick, uniform metallic coating for improved ICT probe life, lubricity for press fit pins, and excellent solderability. Since the formation of intermetallic compounds of Cu6Sn5 and Cu3Sn between the copper substrate and tin coating decreases the solderability and may induce whiskers, various methods have been used in the formulation of immersion tin chemistries to retard the intermetallic and whisker formation processes. This paper compares several immersion tin coatings through the investigation of the kinetics of intermetallic growth and surface oxidation by using Sequential Electrochemical Reduction Analysis; and the associated solderability by wetting balance test.
Yung-Herng Yau Xingping Wang Cai Wang PingPing Ye K.Wengenroth J.Abys
Enthone Inc.,Cookson Electronics West Haven,USA
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）