The Development and Application of Low Dk Material
Introduction The trends for electronic products are toward smaller size, lighter weights, higher speeds and higher frequency applications. Standard FR4 material faces an extreme limit for these applications, especially in regard to Dk, Df and reliability. Decreasing the Dk of the laminate will increase processing speeds of signal (I.e. Pentium processor, Rambus and future processor). The low Dk material can also provide a wider working window in the production process for narrow line PCB.Decreasing the Df of the laminate will reduce not only signal loss during transmission but also thephenomenon of cross talk. The products required low Df include network servers, satellite communicationsand telecom communication equipment etc. The products listed above also need higher reliability inlong-term usage. The factors for improving reliability of laminates are higher Tg, low moisture absorption,stability of material quality and manufacturing process.Normal FR4 material can’t meet the requirement of high-speed circuit design. In order to reduce Dk valuefrom 4.6 to 3.8, Nan Ya try to develop new resin system and combine with low Dk glass cloth. Our goal is todevelop low Dk with low cost material.
Peter Liang
Nan Ya Plastics Electronic Materials-CCL
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）