RoHS and Green Compliance in IC Packaging

摘要：

In the report, the BGA packages with conventional and green material combination were selected as test vehicle for the investigation of MSL/temperature rating in packaging level, The IC packaging was also tested in package level and raw material level to show its RoHS compliance. Furthermore, the chemical substances testing of halogen and Sb2O3 to show the higher level green compliance were concluded.

作者: Jeffrey ChangBing.Lee

作者单位: IST-Integrated Service Technology

会议类型: 国际会议

会议名称: 第十一届世界电子电路大会

会议地点: 上海

会议语种:英文

在线出版日期: 2008-03-17（万方平台首次上网日期，不代表论文的发表时间）