Study on Direct Pattern Printing using Conductive Paste in PCB fabrication

摘要：

A very simple and convenient method to pattern directly on PCBs is developed. This is done by changing from the former wet process to a new dry process. This new dry process, the direct pattern printing method, has great potential to replace traditional wet processes. Additional cost reduction is achieved from 1) the elimination of tools, 2) the reduction in process steps done after photo sensitive film lamination, 3) the absence of the wet process steps such as plating, etching, stripping, and so on and 4) reduced waste treatment expenses. Also, better reliability is expected since there is an insulator between patterns. This holds patterns tightly and gives better peel strength. The direct pattern printing achieves the best process at 0.1 MPa of squeezing pressure, 90 mm/s of printing speed and 200 Pa of vacuum condition. As a result, our proposed screen printer in the direct pattern printing method can give better reliability and litter impact on the environment without any additional cost.

关键词： PCB (Printed Circuit Boards) conductive paste via patterning CCL FC BGA LDI photolithography normal dry film wet process Green PCBs solder resist

作者: Kihwan Kim Jeesoo Mok Eungsuek Lee Jinyong Ahn

作者单位: Technology coordination center,Samsung Electro-Mechanics Co.,LTD 314,Maetan-3 dong,Yeongtong-Gu,Suwon,Gyunggi-Do,Korea 443-743

会议类型: 国际会议

会议名称: 第十一届世界电子电路大会

会议地点: 上海

会议语种:英文

在线出版日期: 2008-03-17（万方平台首次上网日期，不代表论文的发表时间）