Passive Packaging Solutions Using the Fiber-Optic Technology for Optical-PCB-Based Interconnection Systems
We propose alignment-free passive packaging solutions utilizing the fiber-optic technology for optical-PCB-based interconnection systems. The interconnection system for chip-to-chip data link is prepared on the fiber-embedded optical PCB (OPCB). For the vertical coupling of light paths between the OPCB and the optical transceiver modules, 90°-bent fiber connection blocks are used. Employing the guide pins/hole of the conventional ferrules, the passive alignment was achieved with a high accuracy in the assembling of the connection blocks and the transceiver modules in/on the OPCB. Using this assembling scheme, an optical link of 8Gb/s/ch signal with a very low optical loss below 2dB have been demonstrated. An optical data link has been also demonstrated between FPGA microprocessor chips using the same assembling scheme. These systems demonstrate the fusion of the fiber-optic technology and the PCB technology could open commercialization of low-cost and high-quality optical interconnection systems
Hyo-Hoon Park Tea-Woo Lee Sung Hwan Hwang Do Won Kim
Optical Interconnection and Switching Lab,Information and Communications University,Deajeon,Korea Optical Interconnection and Switching Lab,Information and Communications University, Deajeon,Korea
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）