MLB HDI Board Fabrication Process with VIP Structure and BC Material

摘要：

Many PCB Manufacturers are confronting by customer’s strong demands. Kinds of cost down, minimum panel size, low layer count and so on.To satisfy these kinds of customer’s latest trends, I have studied to apply micro-via to MLB to reduce Layer count, Via In Pad structure to meet the smaller component size, BC materials to replace of capacitor components on surface. So, this paper will introduce the process and test results of these three technologies.

作者: Sang Jun BAE

作者单位: ISU PETASYS Co.,Ltd Dae-gu,South Korea

会议类型: 国际会议

会议名称: 第十一届世界电子电路大会

会议地点: 上海

会议语种:英文

在线出版日期: 2008-03-17（万方平台首次上网日期，不代表论文的发表时间）