Realization of Dual Band FEM by Embedded Capacitors and Inductors into Organic Substrate
This paper explains the manufacturing method for Embedded Capacitors into an organic package substrate for Dual Band FEM(Front End Module). Embedded capacitors and inductors were fabricated and characterized for small size handset and other mobile communication system applications at a low cost. In order to improve the performance and the space saving of the FEM over the conventional SiP with L and C components of normal SMT. Embedded Passive technology was applied to the test vehicle by ECURL(Embedded Capacitor Using RCC and Lamination). In the ECURL Process, embedded discrete capacitors are fabricated with BTO high Dk film material and build-up PWB processes. Embedded Inductors are fabricated with normal copper spiral patterns and the quality factors are maximized by using vertically stacked circular geometry. SiP modules with embedded passives into organic substrate, can reduce cost over conventional LTCC technologies, and improve high frequency performance and can reduce module size over conventional SiP with SMTs.
Sang-Kown Yoon In-Myoung Song Han-Sung Lee Jae-Y Park
Daeduck Electronics Co.,Ltd.;Ansan-City,Kyonggi-do,Korea;Kwangwoon University,Seoul,Korea
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）