A Novel Halogen and Phosphorus Free Material for Packaging Substrates
Among semiconductor materials, substrates are specially influenced by RoHS directive due to the common use of tin-lead solder and halogen flame retardants. Many assemblers push for the elimination of halogen compounds along with lead material in the substrate. The material manufacturers adopt reactive phosphorus compounds as a main flame retardant in many cases. Even though this kind of approach has been successfully used for convention FR-4, the same approach turned out to be less than satisfactory for substrate materials. To solve this problem, epoxy resin with high aromaticity was used as base resin and a filler technology was developed to increase the filler load. The resulting material, DS-7409HG (General), has DMA Tg of 240C. In addition, its CTE in z axis is less than 25ppm, which is lower than 50％ of that of conventional FR-4. It also shows an excellent thermal stability, withstanding longer than 30min at 288C. When filler content was further increased applying advanced filler technology, the lower CTE material, S type, was obtained. Its CTE in z axis is less than 15ppm, which is the same as the x and y axis CTE of conventional FR-4. Not only does it contain a high modulus value, it can maintain most of that at high temperature. The other properties of these materials, such as moisture absorption, Td and electric properties will be presented.
KyongWoon Cho Tim (Minsu) Lee DongKi Nam
Doosan Cooperation,Electro-Materials BG Yongin,S.KOREA
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）