Glass Fabric Design for Low Thermal Expansion of PCB
The board for package substrates receives strong stress from thermal expansion in the process of reflowing and exothermal semiconductors.There is great gap of thermal expansion between semiconductors and package substrates.It is preferable to lower coefficient of thermal expansion(CTE) of package substrates. Thermal expansion of laminates is determined with characteristics of base materials (resin, glass fabric and filling).The factor of glass fabric depends on glass composition properties (modulus of elasticity, CTE) and structure (yarn count, treatment). We have tried designing glass fabrics by homogenization method, which is one of the numerical analysis and homogenization method is technique to predict various properties with theoretical equations. Homogenization method expects properties without sample making and testing, and provides us mechanical properties of the composite materials. In this presentation, we will talk about (1) Homogenization method for glass fabrics development (2) Glass fabrics aredeveloped for low thermal expansion package substrates. We simulate CTE of the board by using conventional glass(E-glass) and low thermal expansion glass, as results of simulation, CTE of the board using low thermal expansionglass is 20％ lower than that of E-glass ，and our simulation results are similar to experimental measurement.Homogenization method enable numerical analysis of composite material of the glass fabrics and it is effective forCTE evaluation of glass fabrics. Homogenization method and low thermal expansion glass are useful in the field ofhigh performance PCB.
Minoru Sakurai Koiti Nakamura Naohiro Miyanaga Ryota Koyanagi Norio Hirayama
Nitto Boseki Co.,Ltd 20 Ipponsugi Sakurashimo Fukushima,960-2154,JAPAN
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）