Chemical Formation of Highly Adhesive Cu Layer on Glass Substrate Using an Intermediate ZnO Layer
The fabrication of highly integrated printed wiring boards (PWD) is realized by using smooth glass sheet as the substrate alternative to conventional polymer sheet, but the preparation of adhesive Cu layer is difficult to prepare on glass substrate. We proposed new process of using electrolessly deposited ZnO as the intermediate layer inserted between the Cu layer and glass substrate, and new products to realize the fabrication has been developed. By using newly developed products, highly adhesive Cu layer was formed on smooth glass substrate without any etching process, which results in the rough surface. And, the preparation of 100--width Cu circuits on glass substrate has been demonstrated.
Satomi Otomo Jun-ichi Katayama Masanobu Izaki
Okuno Chemical Industries Co.,Ltd.;Dept.of Production Systems Engineering,Toyohashi University of TechnologyTsurumi-ku,Osaka,538-0044 Japan;Tempaku-cho,Toyohashi City,Aichi,441-8580 Japan
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）