Super thin any layer IVH structure substrate using conductive paste interconnection and its high frequency characteristics

摘要：

Needs for miniaturization and more advanced functions for information communication devices are increasing dramatically in recent years. We have been manufacturing ALIVH-C?which combining high wiring density ALIVH?that utilizing conductive paste interconnection and general build-up substrate. Now we report that we developed super thin substrate using 30 micron prepreg on insulator. Moreover, we report that same RF characteristic was obtained as plating interconnection after evaluating RF characteristic against conductive paste interconnection.

作者: So Kagamihara

作者单位: Panasonic Electronic Devices Co.,Ltd Osaka,Japan

会议类型: 国际会议

会议名称: 第十一届世界电子电路大会

会议地点: 上海

会议语种:英文

在线出版日期: 2008-03-17（万方平台首次上网日期，不代表论文的发表时间）