A Development and Applied Technology of High Accuracy Selective Etching Solutions
Continuous efforts to develop higher-level technologies for PWB (Printed Wiring Board) fabrication such as formation of finer patterns or embedding of passive components have brought about a reduction in size and weight of electronic devices. The demands for formation of finer patterns increase not only in the field of PWB but also in the field of semiconductor package represented by WL-CSP (Wafer Level Chip Scale Package) due to, for instance, a narrowing in pitch of metal bumps as connecting terminals in COC (Chip On Chip) technology. It is considered that a wet etching process plays an extremely important role in order to push the miniaturization forward. Therefore, various kinds of high-performance etching solutions have been introduced. In particular, the demands for selective etching solutions that can etch only specific metal from co-existing metals on the surface of PWB or WL-CSP have been increasing. In this paper we will introduce three selective etching solutions, describe their applications and show their evaluation results; a selective etching solution for nickel, for nickel-phosphorus alloy applied to the embedded resistor layer, and for copper sputtering layer.
Ryo Ogushi Daisaku Akiyama
MEC COMPANY LTD.Amagasaki,Hyogo,JAPAN
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）