Fine Pattern Printing of Silver Nanoparticles Showing Volume Resistivity of 10 μΩcm by Drying at Room Temperature
Introduction Metal inks in which noble metal nanoparticles are dispersed in solvent have been developed with new drawing methods of a printed circuit board, for example, inkjet drawing, flexographic printing, gravure printing, and others1-4. It is well known that noble metal nanoparticles can sinter at much lower temperature than the melting point of a bulk metal5. It is required that metal inks can sinter at low temperature to be formed conductive pattern showing low resistivity. Sintering temperatures of typical metal inks are about 150–250 °C. The market requires metal inks that can sinter at much lower temperature to apply substrates made of inexpensive polymer film and paper. In ideal metal nanoparticles, it is well known that sintering temperature depend on particle size5. On the other hand, practical metal nanoparticles dispersed in solvent are adsorbed with organic dispersant on the surface of nanoparticles. So, it seems that sintering temperature of practical metal nanoparticles depend on surface conditions rather than particle size. In this work, we study the effect of surface conditions of Ag nanoparticles on sintering temperature.
Masafumi Takesue Mitsuru Yamada Takuya Tomura Katsuhiko Hata Shigeo Kuwamoto
Bando Chemical Industries,Ltd Hyogo Science and Technology Association,Kobe,Japan
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）