Thin and Elastic Substrate Materials for Ultra-thin Multilayer Boards
New laminate materials we have developed for ultra-thin multilayer boards consist of ultra-thin glass fabric and a novel low elastic modulus thermosetting resin system. They bring about various lineups with the same resin system ; laminate (TC-C), prepreg (TC-P) , resin-coated copper foil(TC-F), adhesive resin film (TC-A). By using these lineups, it is possible to fabricate a variety of thin multilayer PWB.Especially, with TC-C and TC-F, a bendable part and a multilayer part can be easily fabricated in a unity. Since the cover-layer and the bonding sheet are unnecessary, thinner PWB of higher density can be made. In addition, the circuit manufacturing process will be simpler to provide thinner and bendable multilayer PWB (like a Rigid/Flex PWB) with higher reliability.
Toshiyuki Iijima Nozomu Takano Kenichi Ikeda Masashi Tanaka
Printed Wiring Board Materials R&D Dept.,Hitachi Chemical Co.,Ltd.1500 Ogawa,Chikusei-shi,Ibaraki,308-8521 Japan
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）