New Halogen-Free Laminate for Advanced Package Substrate
Nowadays, the demand for the printed wiring board (PWB) of the environment harmony type is rising rapidly. We have developed a new halogen-free material with low coefficients of thermal expansion (CTE), which will be applied to the plastic packages such as FC-BGA and CSP. The original resin system and filler treatment technique named FICS(Filler Interphase Control system) were applied to develop the material1-3.The newly developed halogen-free material named MCL-E-679FG(S) has a higher glass transition temperature (Tg), peel strength, and heat resistance than the conventional halogen-free materials. Their properties are advantageous to the melting temperature rise of the lead-free solder.Another newly developed halogen-free material named MCL-E-679GT has lower CTE combined with standard glass fabric(E-glass). It has been developed by new resin system. It’s advantage is to reduce of PKG warpage, such as Package on Package (PoP), during heat process for chip mounting.In order to meet fine-line formation, we developed profile-free copper foil. Combined with it, we have confirmed to make fine line of 60μm or less pitch with 18um copper thickness by conventional subtractive method. It will be effective for advanced package substrate such as high density CSP.
Masahisa Ose Tetsuro Irino Kazunaga Sakai Takahiro Tanabe
Hitachi Chemical Co.,Ltd.1500 Ogawa,Chikusei-Shi,Ibaraki,Japan
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）