New Copper Surface Treatment System for Ultra Fine Conductor Patterns
Roughening process of copper surface is widely used to enhance adhesion of copper to resin for Printed Wiring Boards. The process generally roughens copper surface by micro etching, which enhances adhesion of copper to resin by superior anchor effect. However, it has possible issues in the near future such as the transmission loss of signal due to roughened copper surface and the reduction of line width by the etching of copper. To solve these issues, we have developed new copper surface treatment system, that is, FlatBOND. It is confirmed that this new FlatBOND treated copper surface gives high adhesion to resin with providing a profile free surface by Scanning Electron Microscope (SEM) observation. In addition, the reduction of line width is hardly observed after FlatBOND treatment by Laser Microscope measurement. According to the surface observation at higher magnification by Field Emission-SEM (FE-SEM), many nano-scacle minute holes are observed at FlatBOND treated surface. And also, according to X-ray Photoelectron Spectroscopy (XPS) measurement, oxide layer of Sn-Cu alloy is observed on the FlatBOND treated surface. These results indicate the possibilities that physical bonding by nano-scale minute structure and/or chemical bonding by Sn-Cu oxide layer contribute to the high adhesion performance of FlatBOND treated copper surface to resin.
Tsuyoshi Amatani Satoshi Saito Mutsuyuki Kawaguchi
MEC COMPANY LTD.Higashihatsushima-cho,Amagasaki,Hyogo,Japan
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）