Development of Flame Retarding Glass-Epoxy Laminates without Halogen or Phosphorous Compounds
Highly flame-resistant glass-epoxy laminates without flame-retarding additives such as halogen and phosphorous compounds have been developed to overcome environmental problems caused by these additives. The laminates mainly consist of a self-extinguishing epoxy-resin compound (phenol aralkyl), an incombustible-gas generator (amino-triazine-novolac hardener: ATN hardener), and inorganic materials such as a charring promoter (zinc molybdate on talc: ZMT) and a limited amount of harmless metal hydroxide (aluminum trihydroxide: ATH). They are highly flame-resistant and have other beneficial characteristics, including soldering-heat resistance, humidity resistance, electronic properties, and processing advantages. These qualities make them practical enough to replace the FR-4 type printed wiring boards (PWBs) that are widely used today. The resistance to falling weight impact and thermal stress of new build-up PWBs, which were mounted a 0.5mm pitch CSP (Chip Size Package), satisfied the standards needed for mobile phones.
Yukihiro Kiuchi Masatoshi Iji Hiroaki Nagashima Takashi Miwa
Nano Electronics Research Laboratories,NEC Corporation 34,Miyukigaoka,Tsukuba,Ibaraki 305-8501,Japan Electronics Material Division,Research & Development DEP.,Arisawa Manufacturing CO.,LTD.1-Nakadahara
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）