Novel Low Df, High Tg and Halogen-Free Thermosetting System for High Frequency Module
We developed MEK soluble high performance unique curing system based on Bismaleimide (BMI) with alkyl groups and Amino Triazine Novolac resin (ATN). The new development could make commercial use of this curing system possible by break-through in the problems of solvent solubility and curing speed in the past similar system. The new curing system satisfied characteristics required for high-end PCB. This curing system provided Tg (DMA):225°C, UL-94: V-0, Df @1GHz: 0.005 and good mechanical strength. These physical properties are provided with combination of the polyimide and epoxy network.
Hiroshi Moriyama
Dainippon Ink and Chemicals,Incorporated (DIC Corporation) Ichihara,Chiba
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）