Development of Halogen-free Prepreg Available for Additive Process in Order to Attain Ultra-fine Printed Wiring Boards
To cope with high density wiring for printed wiring board, additive process have been adopted by PWB manufacturers, however, they have still following issues;1)Film and ink as materials for additive process are marketed, however, rigidity of these materials is low in comparison with a prepreg which is used in conventional multilayer PWB.2) Investment of new equipment such as vacuum lamination system is required in many cases.Therefore, the authors developed new base material available for additive process in order to resolve above described issues. Newly developed base material is new prepreg comprising of epoxy-based resin, inorganic filler and glass cloth. It has high elasticity property by including glass cloth and it is possible to fabricate insulation layers for multi-layers employing conventional press machine for conventional multilayer processes. In addition, it has higher plating adhesion more than 0.8kN/m that conventional prepreg does not attain when formed plating copper directly on its surface by manufacturing processes of conventional desmear treatment, electroless copper plating, and electrolytic copper plating. Accordingly, this prepreg is applicable to additive process and fine pattern (e.g. less than L/S=50/50 microns) can be achieved by its process. Also, this newly developed prepreg is designed as halogen-free that does not include brominated flame retardant material for environmental conservation and which have overall properties such as laser prosessability, reliability, and shelf life at room temperature as those of FR-4 prepreg.Thus, this newly developed halogen-free prepreg can be recommended as one of solution method for additive process issue
Tomoaki Iwami Tomoaki Watanebe Hiroaki Fujiwara Tatsuo Yonemoto
Matsushita Electric Works,Ltd 111,Azaishizuka,Koriyama,Fukushima 963-8556,Japan
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）