Study on the Relation between Flatness and Abnormal Deposition in Acid Copper Plating for the State-of-the Art PWBs
In company with upgrading of PWBs, further improvement in plating technologies has also been expected lately. With regard to the acid copper plating solution for PWBs, great emphasis was placed first on “good leveling, then on “applicability to PWBs with holes of minor diameter and high aspect ratio, that is, demand for additives free from tapered plating, and in recent years on “flattening of the surface as well. Flat surface is required because of the following circumstances. In meeting the demand for high density interconnection, substrates themselves have become thinner, resulting in an increase in the number of those on which conditioning/polishing cannot be performed. In consideration of such substrate condition, it is essentially important to consistently form a good film on the substrate by plating. We tried to find suitable additives for and composition of an ultimate plating bath, which is free from tapered plating but with good flattening effect based on electrochemical measurement and results of other tests on the composition of plating solution and additives to it.
Masahiro Sawa
EBARA-UDYLITE CO.,LTD.4-3,Kurigi 2-chome,Asao-ku,Kawasaki-shi,Kanagawa 215-0033,Japan
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）