The reliability of All Polyimide Multi Layer Wiring Board
Along with electronic equipments get smaller, thinner and higher performance day by day, high density wiring boards are required so that many types of such kind of wiring boards have been proposed. As a candidate of next generation wiring boards, we have developed “All Polyimide IVH Co-laminated (APIC) multi layer wiring board1), which is made of polyimide films and employs Lump-Sum process. Compared with the conventional glass-epoxy boards, APIC has following features: thin thickness (less than 300um for 6 layers), low permittivity, halogen free, high flame resistance and high migration-proof. The APIC is also characterized by its interconnection structure, that is, the interstitial via between metal layers are composed by filling the special electro-conductive paste into via holes fabricated by laser machining2). In this paper, we report and discuss the relationship between the boards structure and the reliability of APIC. Through the temperature cycle test (-25℃/125℃),changes of circuit resistance including via were observed. We found that the degree of resistance change depends on the board structure (number of layer and thickness, position of via and so on). The result suggests that stress generated inside the wiring board affects on the connection of interstitial via and yields the resistance change. This relation was also confirmed by numerical simulations.
Takaharu Hondo Hideyuki Fujinami Masahiro Okamoto Satoshi Okude Osamu Nakao
Fujikura Ltd. 1440,Mutsuzaki,Sakura,Chiba,Japan Fujikura Ltd.1440,Mutsuzaki,Sakura,Chiba,Japan
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）