A Study of 0201’s and Tombstoning in Lead-Free Systems
Tombstoning, the phenomena where a chip component stands up on one end during the reflow cycle, is welldocumented and understood in tin-lead systems. It is reported to occur more frequently in lead-free systems, and smaller components are at greater risk than larger ones. A comprehensive DOE was undertaken to characterize tombstoning of 0201 components in different metallurgical solder systems. Factors included pad geometry, board finish, stencil geometry, solder paste type, print and placement offsets, and reflow profile and atmosphere. The experiment was divided into two phases; the results of Phase 1 are analyzed and reviewed.
Lead-free miniaturization tombstoning reflow 0201 components
Paul Neathway Andrew Butterfield Quyen Chu Nick Tokotch Robert Haddick Jean-Marc Peallat Chrys Shea Prashant Chouta
Jabil Circuit St. Petersburg, Florida, USA VI Technology Cookson Electronics Jersey City, NJ, USA
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）