IPC International Technology Roadmap 2006/2007

摘要：

Over the next several years the interconnect technology industry will undergo numerous changes. Some of theses changes will be small and hardly noticeable; others will genuinely change the industry.The IPC International Technology Roadmap for Electronic Interconnections has been a leader in identifying some of these changes since it was first published in 1993. The IPC roadmap is published every two years and the team assembled to write and publish the roadmap are the best experts the interconnect industry has available world wide.

作者: John T.Fisher

作者单位: Interconnect Technology Analysis,Inc

会议类型: 国际会议

会议名称: 第十一届世界电子电路大会

会议地点: 上海

会议语种:英文

在线出版日期: 2008-03-17（万方平台首次上网日期，不代表论文的发表时间）