Implementing HDI and Embedded Passives in a High-Reliability Aerospace Application
High Density Interconnects (HDI or microvias) have been around for over 20 years. The implementation has been focused on small form-factor driven products like mobile phones and cameras. But with the increase use of fine-pitch BGA components and now, very high I/O BGAs (>2000 pins) with very fast rise-times, military and aerospace applications require the use of HDI as well.The paper chronicles the implementation of a HDI Program within a large aerospace/military corporation. From the initial contact of a 60 min. “Lunch-n-Learn to a multi-site implementation of HDI and embedded passives technologies, the stages, struggles and benchmarks are highlighted. The entire program tool only 9 months to complete, essentially due to a coordinated effort of PCB fabricators, industry consultants, EDA/design tool vendors and the dedicated focus of many employees.The paper also describes the training and phases of implementation. One of the most useful new tools was a simulation program that was available to assist the designer in the selection of packaging configuration and EP materials. It provided modeling and simulation of interconnections and multilayer stackups for PCB circuit layout tools with a comparative costing of the density improvements (while design time is reduced) in the use of HDI-microvias/EP over conventional through-hole technology.It is hoped that this study will provide insight and impetus for others to look into the implementation of HDI/EP technologies.
Happy Holden
Mentor Graphics Longmont,CO USA
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）