Effects of Adhesion Promotion Treatment on Electrical Signal Attenuation

摘要：

Oxide alternatives, as well as traditional and reduced oxide chemistries, are coatings or “adhesion promoters used to enhance the bond between imaged and etched inner layer copper surfaces and the pre-preg resin used to bond the layers together in multi-layer printed circuit boards (PCBs). These chemistries impart varying degrees of roughness to the surface of the copper conductors and as a result electrical performance can be affected. The electrical performance characteristics of two oxide alternatives are examined in this study.

作者: Roger Krabbenhoft Bruce Lee

作者单位: IBM Systems and Technology Group,3605 Hwy 52 N, Rochester, MN 55901　 MacDermid Incorporated, 245 Freight St, Waterbury, CT 06702 USA

会议类型: 国际会议

会议名称: 第十一届世界电子电路大会

会议地点: 上海

会议语种:英文

在线出版日期: 2008-03-17（万方平台首次上网日期，不代表论文的发表时间）