Integration of Embedded Capacitors into Flip-Chip Substrate Structures for Improved Power System Noise Decoupling and Charge Supply to the IC
The integration of embedded Thick Film capacitors, Thin Film capacitors, and polyimide based planar capacitor materials in IC packages has been investigated by a joint program sponsored by DuPont with the Georgia Institute of Technology Packaging Research Center (PRC). The PRC provided fabrication, modeling and simulation and DuPont provided the component materials. Test vehicles with different designs were fabricated and tested. The test vehicles included embedded ceramic-fired-on-foil Thick Film and Thin Film capacitors with microvia interconnects and structures with planar capacitor layers. Build-up dielectric layers were structured and interconnected by semi-additive processing and laser microvia technology. Measured electrical performance data were used to create models of alternative package designs and to perform simulations to determine the designs offering the most effective power delivery and noise decoupling in accordance with substrates feature needs projected by the ITRS roadmap.
Karl H.Dietz Daniel I.Amey
DuPont Electronic Technologies;Research Triangle Park,NC,USA
国际会议
上海
英文
2008-03-17（万方平台首次上网日期，不代表论文的发表时间）