A Novel Approach in HDI Microvia Manufacturing: Understanding Laser Direct Drilling

摘要：

Introduction:Microvia formation by laser is one of the key technologies for high-density printed circuit board production. Commercially available laser drill systems include two kinds of laser technology: CO2 laser and UV laser. The CO2 laser is much cheaper and faster than the UV laser but has the disadvantage of low energy adsorption for Cu surface. To overcome this, the industry has mainly been using the conformal mask technique, a complicated imaging and chemical etching process to make an opening in the copper surface to expose the epoxy prior to CO2 laser drilling (Figure 1).

作者: Patrick Brooks Robin Taylor Adrian Zee

作者单位: Atotech Deutschland GmbH; Atotech United Kingdom Ltd

会议类型: 国际会议

会议名称: 第十一届世界电子电路大会

会议地点: 上海

会议语种:英文

在线出版日期: 2008-03-17（万方平台首次上网日期，不代表论文的发表时间）